27 Dec

Surface mount assembly is crucial to the New Product Introduction (NPI) process in the electronics manufacturing industry (SMT). The SMT methodology's high level of automation offers a number of benefits, including automatic mistake correction, simpler and quicker assembly, greater mechanical performance, higher production rates, and lower labor costs. Your product may go through each of these phases in order or you may decide to skip one or two depending on the complexity of the design or your outsourcing strategy. 

                                     SMT Solder Paste Printer 

In it, we'll highlight the special qualities and essential significance of the solder paste printing method for your NPI. You can broaden and improve your comprehension of the top-notch SMT line equipment or SMT solder paste printer in this blog.

The most popular way to apply solder paste to a PCB is by printing it. The application of solder paste correctly is crucial for preventing assembly errors that could have repercussions later in the production cycle. Therefore, it is crucial that your EMS partner properly manages and controls this crucial step. Essentially, flux-based solder paste is powdered solder that has been suspended in a viscous liquid.

As a temporary glue, the flux holds the components in place while waiting for the soldering process to start. Stainless steel, but occasionally nickel, is used as a stencil to apply solder paste to the PCB, and after the solder melts, it creates an electrical and mechanical connection.

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